disco corporate history,production and sales of vitrified grinding wheels begun. 1940 in processing, the equipment manufacturers would usually blame the disco abrasive wheel..dbg (dicing before grinding) process,outline of dbg process. dbg reverses the usual process of fully dicing the wafer after grinding. in dbg, first the wafer is half-cut with a special dicing saw. then .
precision processing equipment, predominantly grinders and dicers, make up roughly half of the firm's sales. the firm generates more than half of its revenue in
dry polishing wheels - disco corporation,in addition to wafer polishing in the conventional grinding process, the dp08 read the operation manual of the cutting/grinding equipment before use.
finish thickness: 25 m process: dbg dicing before grinding read the operation manual of the cutting/grinding equipment before use. do not use the
accessory equipment - disco corporation,dtu1550 is a water supply unit for dicing saws and grinders that provide a stable supply of spindle cooling water or dicing water at a constant temperature and
this introduces the equipment that will be used for the dicing and grinding service at the disco hi-tec singapore (singapore), disco hi-tec europe
corporate report 2019,disco has primarily been involved in the development of equipment such as dicing saws and grinders mounted with blades and wheels. however, the processing.
this introduces the equipment that will be used for the dicing and grinding service at the disco hi-tec singapore (singapore), disco hi-tec europe
grinding - disco corporation, is shown below. disco will help select the optimal processing parameters for your desired applications. surface after typical grinding process, surface after processing with dp kabra used semiconductor equipment
an m-code is a six-digit password provided with the serial number of each disco machine. it is listed on the equipment serial number plate. if
grinding wheels - disco corporation,this new finish grinding wheel is also able to maintain a gettering effect, which is read the operation manual of the cutting/grinding equipment before use.
when you place the first order with us, please explain application information such as materials to grind, sizes, machine, type, and other specification.
solutions - disco corporation,e-mail and telephone communication with customers to complete the specification and related conditions. customer: official order; disco: receipt of work
product lineup. dicing saw dicing saws are machines that use blades to cut workpieces made of materials such as silicon, glass, and ceramics with high
introduction of the gettering dp wheel,1 the gettering effect is a mechanism that forms crystal defects or distortions (= gettering sites) inside the silicon wafer (bulk or backside) and then captures
this function is usable as a user-specified specification. for details, please contact your disco sales representative. contact. please feel free to contact us with
solutions - disco corporation,simultaneous multiple-piece grinding method. mount multiple workpieces on the tape affixed to the dicing frame, secure it to the dag810 chuck table and perform
disco's special double-slotted grinding cassettes hold wafers safely both before and after they are ground ultra-thin. (disco does not offer standard grinding
used disco corporation equipment,our vast inventory of disco corporation equipment includes dicing saws and wafer grinders. our search filters and notifiers help you get the disco corporation
from grinding wheels to a future on the tip of a fountain pen. in 1937 kure city, hiroshima, industrial blade and wheel manufacturers were crowded around the
dicing blades - disco corporation,read the operation manual of the cutting/grinding equipment before use. do not use the precision tooling with modified or customized equipment. do not
the newly developed gf01 series in-feed grinding wheels feature a special read the operation manual of the cutting/grinding equipment before use.
the center offset grinding of taiko wafer,the taiko process is a wafer backgrinding method developed by disco. this process (machine used: dag810 taiko specification). general grinding
direct entry. grinding wheel / dry polishing wheel. product case label (200mm wheel). scan barcode. direct entry. label other than the label for product above.
solutions - disco corporation,small amount of 'dicing and grinding service' must be helpful for customers who can't afford to buy disco machines. they can check their products and it's
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